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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9888558 B1

PDFFull Text
Date of Patent:
Feb. 06, 2018

Filed:

Jun. 03, 2011

Wiring substrate and manufacturing method thereof

Applicants:

Akira Harao, Makinohara, JP;

Mototatsu Matsunaga, Makinohara, JP;

Yasuhiro Sugiura, Makinohara, JP;

Minoru Kubota, Makinohara, JP;

Inventors:

Akira Harao, Makinohara, JP;

Mototatsu Matsunaga, Makinohara, JP;

Yasuhiro Sugiura, Makinohara, JP;

Minoru Kubota, Makinohara, JP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

James Wu

Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H01R 12/72 (2011.01); H05K 3/36 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H01L 23/498 (2006.01); H05K 7/10 (2006.01); H05K 1/05 (2006.01); H05K 3/20 (2006.01); H05K 3/34 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H01R 12/728 (2013.01); H05K 1/0203 (2013.01); H05K 1/11 (2013.01); H05K 3/10 (2013.01); H05K 3/368 (2013.01); H01L 23/49861 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/48091 (2013.01); H01L 2225/1094 (2013.01); H05K 1/05 (2013.01); H05K 1/056 (2013.01); H05K 1/14 (2013.01); H05K 3/202 (2013.01); H05K 3/3447 (2013.01); H05K 7/1046 (2013.01); H05K 2201/09009 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10757 (2013.01); H05K 2201/10787 (2013.01); H05K 2203/025 (2013.01); Y10T 29/49147 (2015.01); Y10T 29/49155 (2015.01);
Abstract

A wiring substrateA includes a high heat radiation substratewhich has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surfacefor a variety of components; a connection terminalwhich is extended from the high heat radiation substrateand bent in a direction perpendicular to a surface of the high heat radiation substrate; and a heat radiation piece sectionwhich is integrally installed to the connection terminal

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