Location History:
- Mino, JP (1990)
- Osaka, JP (2000)
Company Filing History:
Years Active: 1990-2000
Title: Yasuhiro Okuri: Innovator in Adhesive Technologies
Introduction
Yasuhiro Okuri is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of adhesive technologies, holding a total of 2 patents. His work focuses on developing innovative methods that enhance the performance and durability of adhesives used in various applications.
Latest Patents
One of Okuri's latest patents is a weld bonding method. This method provides adhesion through both an adhesive and resistance spot welding. It includes the application of an adhesive that consists of a thermosetting epoxy resin, a latent curing agent, and specific additives. These additives are selected from conductive metals, metal oxides, metal carbides, metal nitrides, metal borides, and metal silicides, which are in the form of powder or flakes.
Another significant patent is for a structural adhesive with excellent anti-corrosion properties. This adhesive comprises a rubber modified epoxy resin, a urethane modified epoxy resin, a latent curing agent, and a rust inhibiting pigment. The formulation is designed to provide exceptional anti-corrosion capabilities, making it particularly useful for heming fixation in automobiles.
Career Highlights
Throughout his career, Yasuhiro Okuri has worked with reputable companies, including Sunstar Giken and The Furukawa Electric Co., Ltd. His experience in these organizations has allowed him to refine his expertise in adhesive technologies and contribute to various innovative projects.
Collaborations
Okuri has collaborated with notable coworkers such as Toshiya Okada and Tomiharu Okita. These partnerships have further enriched his work and led to advancements in adhesive applications.
Conclusion
Yasuhiro Okuri's contributions to adhesive technologies through his patents demonstrate his innovative spirit and commitment to enhancing product performance. His work continues to influence the industry and pave the way for future advancements in adhesive applications.