Sunstar Giken Kabushiki Kaisha

The Furukawa Electric Co., Ltd.

Yasuhiro Okuri

Kiichi Yamashita

Toshimori Sakakibara

Toshiya Okada

Tomiharu Okita

The present invention is a weld bonding method providing adhesion by both an adhesive and resistance spot welding, and includes application of an adhesive including a thermosetting epoxy resin, a latent curing agent and 1 to 15 vol % of one or more additives selected from the group consisting of conductive metals, metal oxides, metal carbides, metal nitrides, metal borides, and metal silicides, which are in the from of powder having a particle size of 10 .mu.m or less, or in the form of fragments or flakes having a thickness of 0.5 .mu.m or more and a size of 30 .mu.m or less.

Weld bonding method

A structural adhesive having excellent anti-corrosion properties which comprises: (A) a rubber modified epoxy resin prepared by reaction of a bisphenol epoxy resin and a butadiene-acrylonitrile-(meth)acrylic acid copolymer, (B) an urethane modified epoxy resin, (C) a latent curing agent, and (D) a rust inhibiting pigment selected from the group consisting of: (i) a rust inhibiting pigment comprising aluminum orthophosphate and a zinc compound, (ii) a rust inhibiting pigment comprising aluminum metaphosphate, a zinc compound and/or an alkaline earth metal compound, and (iii) a rust inhibiting pigment comprising aluminum metaphosphate and a zinc compound and optionally an alkaline earth metal compound, wherein the adhesive contains said rubber modified epoxy resin (A) and said urethane modified epoxy resin (B) in a weight ratio of 1:9 to 3:1, and said latent curing agent (C) and said rust inhibiting pigment (D) at 0.1 to 30% by weight and at 5 to 50% by weight respectively based on a total amount of both modified epoxy resins (A) and (B) is disclosed. The structural adhesive of the present invention has extremely excellent anti-corrosion properties and is useful for heming fixation especially at an edge between an outer panel and an inner panel of an automobile.

Growing community of inventors

Osaka, Japan

Yasuhiro Okuri