The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2000
Filed:
Oct. 21, 1997
Applicant:
Inventors:
Toshiya Okada, Tokyo, JP;
Tomiharu Okita, Tokyo, JP;
Yasuhiro Okuri, Osaka, JP;
Kiichi Yamashita, Osaka, JP;
Assignees:
Furukawa Electric Co., Ltd., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
1562739 ; 156330 ; 228175 ; 523442 ; 523459 ;
Abstract
The present invention is a weld bonding method providing adhesion by both an adhesive and resistance spot welding, and includes application of an adhesive including a thermosetting epoxy resin, a latent curing agent and 1 to 15 vol % of one or more additives selected from the group consisting of conductive metals, metal oxides, metal carbides, metal nitrides, metal borides, and metal silicides, which are in the from of powder having a particle size of 10 .mu.m or less, or in the form of fragments or flakes having a thickness of 0.5 .mu.m or more and a size of 30 .mu.m or less.