Shanghai, China

Yasuhiro Nakagawa

This inventor holds 1 USPTO granted patent. Top assignee: Resonac Corporation. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasuhiro Nakagawa. Retrieved from https://idiyas.com/inventor/yasuhiro-nakagawa-ra0xa8a1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Yasuhiro Nakagawa: Innovator in Adhesive Composition

Introduction

Yasuhiro Nakagawa is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of adhesive technology. His innovative work has led to the development of a unique latex for adhesive compositions.

Latest Patents

Yasuhiro Nakagawa holds 1 patent related to his invention of a latex for adhesive composition. This patent encompasses a latex that contains a polymer of an ethylenic unsaturated monomer with a carboxy group. The polymer has an average particle diameter ranging from 0.30 to 5.00 μm. Additionally, the invention includes a crosslinked structure and an adhesive composition that combines the latex with a chloroprene-based polymer latex.

Career Highlights

Yasuhiro Nakagawa is currently associated with Resonac Corporation, where he continues to advance his research and development efforts in adhesive technologies. His work has been instrumental in enhancing the performance and application of adhesive materials.

Collaborations

Yasuhiro collaborates with Hiroto Kouka, contributing to the innovative projects at Resonac Corporation. Their teamwork has fostered advancements in adhesive compositions.

Conclusion

Yasuhiro Nakagawa's contributions to adhesive technology through his innovative latex compositions highlight his role as a key inventor in this field. His work continues to influence the development of effective adhesive solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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