Handa, Japan

Yasuhiro Ikeda

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Tsukasa Co., Ltd.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasuhiro Ikeda. Retrieved from https://idiyas.com/inventor/yasuhiro-ikeda-v9cumgvj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Yasuhiro Ikeda: Innovator in Sifting Technology

Introduction

Yasuhiro Ikeda is a notable inventor based in Handa, Japan. He has made significant contributions to the field of sifting technology, particularly with his innovative designs that enhance efficiency and effectiveness in granular material processing.

Latest Patents

Yasuhiro Ikeda holds a patent for a cylindrical sieve and cylindrical sifter. This invention features an integrally-rotating cylindrical sieve that includes a hollow rotating shaft, support members that extend radially from the shaft, and a cylindrical sieve body made from a thin plate with numerous apertures. The design incorporates a corrugated plate with wave crests and troughs, which improves sieving efficiency while preventing damage to the granular material. This innovation not only enhances the commercial value of the sieved material but also addresses common issues faced in the sifting process.

Career Highlights

Ikeda is associated with Tsukasa Co., Ltd., where he applies his expertise in developing advanced sifting solutions. His work has been instrumental in improving the quality and efficiency of material processing in various industries.

Conclusion

Yasuhiro Ikeda's contributions to sifting technology exemplify the impact of innovative thinking in enhancing industrial processes. His patented designs reflect a commitment to improving efficiency and quality in material handling.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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