Yasuhiko Ohyama

Title: Yasuhiko Ohyama: Innovator in Film Technology

Introduction

Yasuhiko Ohyama is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of film technology, particularly in the development of films with metal foils. With a total of 3 patents to his name, Ohyama's work has implications for advanced wiring board production.

Latest Patents

One of Ohyama's latest patents involves a film with metal foil, where a metal foil is adhered to the surface of a resin film through an adhesive layer. This adhesive is created by crosslinking an acrylic polymer, which is derived from the copolymerization of a (meth)acrylic acid ester and a carboxyl group-containing radically polymerizable monomer. The process also involves a polyfunctional compound that reacts with the carboxyl group. This innovative film is particularly useful for producing multi-layer wiring boards using the transfer method. The resulting boards feature fine, densely packed wiring and an exceptionally flat surface.

Career Highlights

Throughout his career, Yasuhiko Ohyama has worked with various companies, including Sekisui Chemical Co., Ltd. His experience in these organizations has contributed to his expertise in film technology and innovation.

Collaborations

Ohyama has collaborated with notable individuals in his field, including Akihiko Nishimoto and Katsura Hayashi. These partnerships have likely enhanced his research and development efforts.

Conclusion

Yasuhiko Ohyama's contributions to film technology, particularly through his patents, demonstrate his innovative spirit and commitment to advancing the industry. His work continues to influence the production of multi-layer wiring boards, showcasing the importance of his inventions.