Other

Kyocera Corporation

Sekisui Chemical Co., Ltd.

Sekisui Chemical Corporation

Yasuhiko Ohyama

Katsura Hayashi

Akihiko Nishimoto

Shigeru Danjo

Kazuhiro Shimomura

Masahiko Gotoh

Shigehisa Kobayashi

In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.

Film with metal foil

Disclosed herein is a pressure sensitive adhesive tape or sheet comprising a base layer (substrate) formed of a polyolefin resin and a pressure sensitive adhesive layer laminated on one side of the base layer, optionally, through an intermediate layer. The pressure sensitive adhesive tape or sheet is characterized in that the back surface of the base layer has been applied with shearing force so as to subject it to a surface treatment and is improved in unwinding ability, namely, is capable of rerolling with small force when it is wound into a roll.

Method of making a pressure sensitive adhesive tape or sheet

Growing community of inventors

Osaka, Japan

Yasuhiko Ohyama