Otsu, Japan

Yasuaki Tsutsumi

This inventor holds 3 USPTO granted patents. Top assignees: Toray Industries, Inc., Other. Active years: 2002-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasuaki Tsutsumi. Retrieved from https://idiyas.com/inventor/yasuaki-tsutsumi-2ebw8xji

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 66.7

Average Co-Inventor Count = 4.9

ph-index = 3

Forward Citations = 25(Granted Patents)


Location History:

  • Inazawa, JP (2002)
  • Otsu, JP (2003 - 2006)

Company Filing History:


Years Active: 2002-2006

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Yasuaki Tsutsumi - Innovator in Semiconductor Technology

Introduction

Yasuaki Tsutsumi, a prolific inventor based in Otsu, Japan, has made significant contributions to the field of semiconductor technology. With a total of three patents to his name, Tsutsumi's work primarily focuses on innovative solutions for improving the reliability and efficiency of semiconductor devices.

Latest Patents

Among his latest patents is the invention of a "Semiconductor joining substrate utilizing a tape with adhesive and copper-clad laminate sheet." This invention presents a unique adhesive-backed tape specifically designed for semiconductor applications. The tape consists of a laminate of an insulating film layer, which possesses certain critical characteristics, and includes at least one adhesive agent layer in a semi-cured state. This construction enables industrial-scale production of adhesive-backed tapes suitable for creating semiconductor devices, copper-clad laminates, semiconductor connecting substrates, and ultimately enhances the reliability of semiconductor devices for high-density mounting.

Another notable patent from Tsutsumi is a "Semiconductor-sealing resin composition and semiconductor device using it." This innovation comprises a resin composition designed for sealing semiconductor devices, containing a filler of spherical fused silica with a maximum particle size not larger than 45 µm. Additionally, it may incorporate metal impurities of up to 53 µm. This resin composition enhances the durability and efficacy of semiconductor devices.

Career Highlights

Tsutsumi has garnered valuable experience through his tenure at various firms, notably at Toray Industries, Inc., where he honed his expertise in semiconductor materials and technologies. His inventions often bridge the gap between innovative design and practical application, making significant impacts on technology in real-world settings.

Collaborations

Working alongside talented individuals such as Masayuki Tanaka and Toshimi Kawahara, Tsutsumi has engaged in collaborative efforts that have further advanced semiconductor innovations. These partnerships highlight the importance of teamwork in driving technological progress.

Conclusion

Yasuaki Tsutsumi stands out as an influential figure in the realm of semiconductor technology, with his inventive works addressing critical challenges in the industry. His latest patents are testaments to his dedication to enhancing reliability and efficiency in semiconductor devices, reinforcing his legacy as a notable inventor in modern engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…