The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2006
Filed:
Aug. 22, 2001
Mikihiro Ogura, Kusatsu, JP;
Syouji Kigoshi, Otsu, JP;
Masami Tokunaga, Otsu, JP;
Yasuaki Tsutsumi, Otsu, JP;
Ryuichi Kamei, Kyoto, JP;
Ken Shimizu, Kyoto, JP;
Mikihiro Ogura, Kusatsu, JP;
Syouji Kigoshi, Otsu, JP;
Masami Tokunaga, Otsu, JP;
Yasuaki Tsutsumi, Otsu, JP;
Ryuichi Kamei, Kyoto, JP;
Ken Shimizu, Kyoto, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
The present invention relates to an adhesive-backed tape for semiconductors which is characterized in that it is composed of a laminate of an insulating film layer having the following characteristics (1) and (2) and at least one adhesive agent layer in the semi-cured state. By means of this construction the present invention can provide, on an industrial basis, an adhesive-backed tape suitable for producing semiconductor devices, together with copper-clad laminates, semiconductor connecting substrates and semiconductor devices employing said tape, and it enables, the reliability of semiconductor devices for high density mounting to be enhanced.