Tucson, AZ, United States of America

Yasa Adi Sampurno

This inventor holds 3 USPTO granted patents and 12 published patent applications. Top assignee: Araca Incorporated. Active years: 2012-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasa Adi Sampurno. Retrieved from https://idiyas.com/inventor/yasa-adi-sampurno

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2012-2016

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3 patents (USPTO):Explore Patents

Title: Yasa Adi Sampurno: Innovator in Chemical Mechanical Polishing Technology

Introduction

Yasa Adi Sampurno is a notable inventor based in Tucson, AZ (US). He has made significant contributions to the field of chemical mechanical polishing (CMP) technology, holding a total of 3 patents. His innovative approaches have enhanced the efficiency and effectiveness of semiconductor wafer processing.

Latest Patents

Yasa's latest patents include a method and device for the injection of CMP slurry. In one embodiment, the invention comprises an apparatus for injecting slurry between the wafer and the pad during the chemical mechanical polishing of semiconductor wafers. This apparatus features an injector with a leading edge that possesses bays, depressions, or notches to capture spent slurry. This design allows for heat transfer from the polishing reaction to the pad or through the injector to the new slurry before the spent slurry is expelled from the polishing pad. The result is a considerable improvement in the removal rate, reduced slurry consumption, and decreased operating time.

Another patent discloses an apparatus for injecting slurry onto the polishing pad surface of a CMP tool. This apparatus includes a rectilinear shaped injector bottom with multiple slots created in the top surface. These slots allow the injector bottom to flex and conform to the polishing pad profile. CMP slurry or its components are introduced through one or more openings, travel through the injector body, and exit through a slit or bottom surface opening. The injector spreads the slurry into a thin film and introduces it at the gap between the polishing pad and the wafer, ensuring that most of the slurry is effectively utilized.

Career Highlights

Yasa Adi Sampurno is currently employed at Araca Incorporated, where he continues to develop innovative solutions in the semiconductor industry. His work has been instrumental in advancing CMP technology, making processes more efficient and effective.

Collaborations

Yasa has collaborated with notable colleagues, including Leonard John Borucki and Ara Philipossian. Their combined expertise has contributed to the success of various projects and innovations in the field.

Conclusion

Yasa Adi Sampurno is a distinguished inventor whose work in CMP technology has led to significant advancements in semiconductor processing. His innovative patents and contributions continue to shape the industry, demonstrating the impact of his expertise and creativity.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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