The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2016

Filed:

Dec. 16, 2010
Applicants:

Leonard John Borucki, Mesa, AZ (US);

Yasa Adi Sampurno, Tucson, AZ (US);

Ara Philipossian, Tucson, AZ (US);

Inventors:

Leonard John Borucki, Mesa, AZ (US);

Yasa Adi Sampurno, Tucson, AZ (US);

Ara Philipossian, Tucson, AZ (US);

Assignee:

Araca Inc., Tucson, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 57/04 (2006.01); B24B 57/02 (2006.01); B24B 37/10 (2012.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
B24B 57/02 (2013.01); B24B 37/04 (2013.01); B24B 37/10 (2013.01);
Abstract

In a certain embodiment, the invention comprises an apparatus for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising an injector the leading edge of which possess bays, depressions or notches that capture spent slurry and hold it long enough for it to transfer heat from the polishing reaction to the pad or through the injector to the new slurry before the said spent slurry is thrown from the polishing pad. The effect is to considerably improve the removal rate, reduce slurry consumption and reduce operating time.


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