Yunlin, Taiwan

Yao-Hong You

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yao-Hong You. Retrieved from https://idiyas.com/inventor/yao-hong-you

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Yao-Hong You: Innovator in Semiconductor Device Technology

Introduction

Yao-Hong You is an inventor based in Yunlin County, Taiwan. He has made significant contributions to the field of semiconductor device technology. His innovative approach focuses on simplifying fabrication processes, which can lead to more efficient manufacturing techniques.

Latest Patent Applications

Yao-Hong You has filed a patent application titled "INTERCONNECT STRUCTURE FOR MULTI-THICKNESS SEMICONDUCTOR DEVICE." This application describes a method of forming an interconnect structure that eliminates the need for a separate deep via patterning process. The method involves forming a first dielectric layer over a first metal line and creating a through-hole that exposes a first contact region of the first metal line. A second dielectric layer is then deposited and patterned to form a first via-hole connecting to the through-hole and a second via-hole that exposes a second contact region of the second metal line. The application details the formation of a first via on the first contact region and a second via on the second contact region, extending to the upper surfaces of the second dielectric layer.

Conclusion

Yao-Hong You's work in semiconductor device technology showcases his innovative spirit and dedication to improving fabrication processes. His contributions, particularly through his latest patent application, highlight the potential for advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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