This inventor holds 1 USPTO granted patent and 11 published patent applications. Top assignee: Qualcomm Incorporated. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Yanmei Song: Innovator in Integrated Device Packaging
Introduction
Yanmei Song is a prominent inventor based in San Diego, CA. She has made significant contributions to the field of integrated device packaging. Her innovative work has led to the development of a unique patent that enhances the functionality and efficiency of electronic devices.
Latest Patents
Yanmei Song holds a patent for a "Package comprising a chiplet located between an integrated device and a metallization portion." This patent describes a package that includes a first metallization portion, a first integrated device coupled to the metallization portion through a first plurality of pillar interconnects, and a first chiplet positioned between the integrated device and the metallization portion. The chiplet can be either active or passive, and it is coupled to the integrated device through inter-pillar interconnects. This innovation is crucial for improving the performance of electronic systems.
Career Highlights
Yanmei Song is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. Her work at Qualcomm has allowed her to collaborate with some of the brightest minds in technology. She has been instrumental in advancing the company's research and development efforts.
Collaborations
One of her notable coworkers is Jianwen Xu, who has also contributed to the field of integrated device packaging. Their collaboration has fostered an environment of innovation and creativity within their team.
Conclusion
Yanmei Song's contributions to integrated device packaging exemplify her dedication to innovation in technology. Her patent and work at Qualcomm highlight her role as a key player in advancing electronic device performance.