The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Aug. 23, 2022
Qualcomm Incorporated, San Diego, CA (US);
Yanmei Song, San Diego, CA (US);
William Stone, San Diego, CA (US);
Jianwen Xu, San Diego, CA (US);
Senthil Sivaswamy, San Diego, CA (US);
John Holmes, Escondido, CA (US);
Ryan Lane, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
A package comprising a first metallization portion, a first integrated device coupled to the first metallization portion through a first plurality of pillar interconnects, and a first chiplet located between the first integrated device and the first metallization portion. The first chiplet is coupled to the first integrated device through a first plurality of inter pillar interconnects. The first chiplet may include an active chiplet. The first chiplet may include a passive chiplet.