This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Sekisui Chemical Co., Ltd.. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: Yangsoo Lee - Innovator in Semiconductor Adhesives
Introduction
Yangsoo Lee is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of adhesives used for bonding semiconductor chips. His innovative approach has led to advancements that enhance the efficiency and effectiveness of semiconductor manufacturing.
Latest Patents
Yangsoo Lee holds a patent for an adhesive specifically designed for semiconductor bonding. This adhesive is characterized by its high transparency, which facilitates the recognition of patterns or position indications during the bonding process. The invention includes an epoxy resin, an inorganic filler, and a curing agent. The formulation specifies that the inorganic filler constitutes 30 to 70% by weight, with two types of fillers: filler A, which has an average particle size of less than 0.1 µm, and filler B, which ranges from 0.1 µm to less than 1 µm. The weight ratio of filler A to filler B is maintained between 1/9 to 6/4. Additionally, the adhesive ensures that the difference in refractive index between the epoxy resin and the inorganic filler does not exceed 0.1.
Career Highlights
Yangsoo Lee is associated with Sekisui Chemical Co., Ltd., where he has been instrumental in advancing adhesive technologies for semiconductor applications. His work has not only contributed to the company's portfolio but has also positioned him as a key figure in the semiconductor industry.
Collaborations
Yangsoo Lee collaborates with talented colleagues, including Atsushi Nakayama and Sayaka Wakioka. Their combined expertise fosters an environment of innovation and creativity, leading to groundbreaking developments in their field.
Conclusion
Yangsoo Lee's contributions to semiconductor bonding adhesives exemplify the importance of innovation in technology. His patent reflects a commitment to enhancing manufacturing processes and improving product quality. Through his work, he continues to influence the semiconductor industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile