The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Mar. 18, 2010
Yangsoo Lee, Osaka, JP;
Sayaka Wakioka, Osaka, JP;
Atsushi Nakayama, Osaka, JP;
Carl Alvin Dilao, Osaka, JP;
Yangsoo Lee, Osaka, JP;
Sayaka Wakioka, Osaka, JP;
Atsushi Nakayama, Osaka, JP;
Carl Alvin Dilao, Osaka, JP;
Sekisui Chemical Co., Ltd., Osaka, JP;
Abstract
The present invention is aimed to provide an adhesive for bonding a semiconductor which has high transparency and facilitates recognition of a pattern or position indication on the occasion of semiconductor chip bonding. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein the amount of the inorganic filler in the adhesive is 30 to 70% by weight, the inorganic filler contains a filler A having an average particle size of less than 0.1 μm and a filler B having an average particle size of not less than 0.1 μm and less than 1 μm, and the weight ratio of the filler A to the filler B is 1/9 to 6/4. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein difference in refractive index is not more than 0.1 between the epoxy resin and the inorganic filler.