Taoyuan, Taiwan

Yanggui Feng

This inventor holds 1 USPTO granted patent. Top assignee: Delta Electronics, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yanggui Feng. Retrieved from https://idiyas.com/inventor/yanggui-feng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations by Yanggui Feng: A Look at His Contributions

Introduction

Yanggui Feng is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of technology, particularly in the area of substrate fastening devices. His innovative approach has led to the development of a unique patent that addresses specific challenges in substrate assembly.

Latest Patents

Yanggui Feng holds a patent for a substrate-fastening device and a substrate-assembling structure using the same. This invention includes a base that carries a substrate with a perforation. The fastening component is designed to correspond with the perforation and includes several key features such as a supporting portion, a positioning portion, a resin-attaching portion, an end portion, and a fixation resin. The design ensures that the substrate is securely supported and positioned, enhancing the efficiency of substrate assembly.

Career Highlights

Yanggui Feng is currently associated with Delta Electronics, Inc., where he continues to innovate and contribute to advancements in technology. His work at Delta Electronics has allowed him to apply his inventive skills in a practical setting, leading to the development of solutions that meet industry needs.

Collaborations

Due to space constraints, the collaborations section will be omitted.

Conclusion

Yanggui Feng's contributions to the field of substrate fastening devices exemplify the impact of innovation in technology. His patent reflects a commitment to solving practical problems in substrate assembly, showcasing his skills as an inventor.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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