The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2026

Filed:

Jun. 06, 2022
Applicant:

Delta Electronics, Inc., Taoyuan City, TW;

Inventors:

Yanggui Feng, Taoyuan City, TW;

Shaojun Chen, Taoyuan City, TW;

Assignee:

Delta Electronics, Inc., Taoyuan City, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/54 (2006.01); B29L 31/34 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
B29C 65/54 (2013.01); B29L 2031/3425 (2013.01); H05K 1/0201 (2013.01);
Abstract

A substrate-fastening device and a substrate-assembling structure are disclosed. The substrate-fastening device includes a base and a fastening component. The base correspondingly carries a substrate including a perforation. The fastening component is disposed on the base, corresponds to the perforation, and includes a supporting portion, a positioning portion, a resin-attaching portion, an end portion and a fixation resin. The supporting portion is disposed on the base to support the substrate. The positioning portion is disposed on a supporting surface of the supporting portion and extended along the perforation. The resin-attaching portion is extended along the perforation. The end portion is connected to the positioning portion through the resin-attaching portion. The fixation resin is disposed around the resin-attaching portion and connected between the end portion and the positioning portion. The fixation resin covers the second surface adjacent to the perforation, and fills the gap between the resin-attaching portion and the perforation.


Find Patent Forward Citations

Feng, Yanggui. (2026). Substrate-fastening device and substrate-assembling structure using same (U.S. Patent No. 12583190). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12583190

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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