Taipei, Taiwan

Yang-Sen Yeh

This inventor holds 1 USPTO granted patent. Top assignee: Winbond Electronics Corporation. Active years: 1998.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yang-Sen Yeh. Retrieved from https://idiyas.com/inventor/yang-sen-yeh-23wc92bd

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1998

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1 patent (USPTO):Explore Patents

Title: Yang-Sen Yeh: Innovator in Integrated Circuit Technology

Introduction

Yang-Sen Yeh is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of integrated circuit technology. His innovative approach has led to the development of a unique method aimed at preventing electrostatic discharge failures in integrated circuits.

Latest Patents

Yang-Sen Yeh holds a patent for a method designed to prevent electrostatic discharge failure in an integrated circuit package. This patent describes an integrated circuit package that includes a semiconductor chip, bonding pads on the semiconductor chip, a plurality of wired pins wire-bonded respectively to the bonding pads, and at least one non-wired pin. The non-wired pin is electrically connected to an adjacent wired pin to mitigate the risk of electrostatic discharge failure.

Career Highlights

Yang-Sen Yeh is currently employed at Winbond Electronics Corporation, where he continues to innovate in the field of electronics. His work focuses on enhancing the reliability and performance of integrated circuits, which are crucial components in modern electronic devices.

Collaborations

Some of his notable coworkers include Kow-Liang Wen and Ta-Lee Yu, who collaborate with him on various projects within the company.

Conclusion

Yang-Sen Yeh's contributions to integrated circuit technology exemplify the importance of innovation in electronics. His patent for preventing electrostatic discharge failure showcases his commitment to improving the reliability of electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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