Hsinchu, Taiwan

Yang-Hui Fang

This inventor holds 2 USPTO granted patents. Top assignee: Mediatek Corporation. Active years: 2010-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yang-Hui Fang. Retrieved from https://idiyas.com/inventor/yang-hui-fang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2010-2011

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2 patents (USPTO):Explore Patents

Title: Innovations of Yang-Hui Fang in Semiconductor Technology

Introduction

Yang-Hui Fang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Yang-Hui Fang's latest patents include innovative designs for bond pad structures and semiconductor devices. The first patent describes a semiconductor device that comprises a first semiconductor die and a second semiconductor die. The first semiconductor die features at least one first bond pad located on its peripheral region, along with a re-distributed layer (RDL) pad situated in the center region. This design includes wire routes that interconnect the first bond pads and the RDL pads. The second semiconductor die is positioned over the first, with its bond pads electrically connecting to the RDL pads via bonding wires, supported by a buffer layer.

The second patent presents a multiple-die semiconductor device that also includes a first and a second semiconductor die. In this design, the first semiconductor die contains multiple first bond pads on its peripheral region and several RDL pads in the center. The second semiconductor die is placed above the first, featuring second bond pads that connect to the RDL pads through bonding wires. This RDL pad is supported by a layer of stress-releasing metal located directly underneath.

Career Highlights

Yang-Hui Fang is currently employed at MediaTek Corporation, a leading company in semiconductor technology. His work at MediaTek has allowed him to develop cutting-edge solutions that address the challenges faced in the semiconductor industry.

Collaborations

Yang-Hui Fang collaborates with Chao-Chun Tu, contributing to advancements in semiconductor technology through their combined expertise.

Conclusion

Yang-Hui Fang's contributions to semiconductor technology through his innovative patents demonstrate his commitment to advancing the field. His work continues to influence the development of efficient semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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