This inventor holds 2 USPTO granted patents and 7 published patent applications. Top assignee: Delta Electronics, Inc.. Active years: 2025-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025-2026
Title: Yanbing Xia: Innovator in Power Module Packaging
Introduction
Yanbing Xia is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of electrical engineering, particularly in the area of power module packaging. His innovative approach has led to the development of a unique method that enhances the efficiency and reliability of electronic devices.
Latest Patents
Yanbing Xia holds a patent for a method for forming a power module package. This patent outlines a comprehensive process that includes providing a power module with an electrical element and an electrical connection portion. The method also involves the use of an electrical connection terminal that features a connection end, an extension portion, and an end cap. The innovative packaging technique ensures that the power module and the electrical connection terminal are effectively encapsulated, resulting in a robust packaged body.
Career Highlights
Yanbing Xia is currently employed at Delta Electronics, Inc., where he continues to push the boundaries of innovation in electronic packaging. His work has not only contributed to the advancement of technology but has also positioned him as a key figure in the industry. With a focus on practical applications, his inventions aim to improve the performance and durability of electronic devices.
Collaborations
Throughout his career, Yanbing Xia has collaborated with talented individuals such as Quansong Luo and Yanggui Feng. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
In summary, Yanbing Xia is a distinguished inventor whose work in power module packaging has made a significant impact on the electronics industry. His innovative methods and collaborative spirit continue to inspire advancements in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
