The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 12, 2025

Filed:

Sep. 25, 2023
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Quansong Luo, Shanghai, CN;

Yanbing Xia, Shanghai, CN;

Yanggui Feng, Shanghai, CN;

Xi Liu, Shanghai, CN;

Kaijian Yang, Shanghai, CN;

Liang Jin, Shanghai, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2025.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0069 (2013.01); H05K 3/328 (2013.01); H05K 3/3415 (2013.01); H05K 3/3457 (2013.01);
Abstract

A method for forming a power module package includes providing a power module including an electrical element and an electrical connection portion; providing an electrical connection terminal including a connection end, an extension portion and an end cap, wherein the extension portion is extended between the connection end and the end cap and has a hollow cavity therein; disposing the electrical connection terminal on the electrical connection portion for electrically connecting the connection end to a corresponding electrical connection portion; packaging the power module and the electrical connection terminal through an encapsulant to form a packaged body; removing a portion of a surface of the packaged body for exposing the end cap of the electrical connection terminal; and removing the end cap to expose the hollow cavity of the electrical connection terminal, so as to form the power module package.


Find Patent Forward Citations

Luo, Quansong. (2025). Method for forming power module package, power module package and electronic device (U.S. Patent No. 12389553). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12389553

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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