This inventor holds 2 USPTO granted patents. Top assignees: Columbia University, University of Pittsburgh. Active years: 2026.
Company Filing History:


Years Active: 2026
Title: Yanan Dai - Innovator in Topological Plasmonics
Introduction
Yanan Dai is a prominent inventor based in New York, NY (US). She has made significant contributions to the field of plasmonics, particularly in the development of systems and methods for forming topological lattices of plasmonic merons. Her innovative work has the potential to advance lithography techniques beyond the limitations imposed by traditional optical systems.
Latest Patents
Yanan Dai holds a patent for "Systems and methods for forming topological lattices of plasmonic merons." This patent describes methods and systems for assembling electron spin and charge to create a topological plasmonic spin texture array. The invention allows for lithography that is not constrained by the diffraction limit of optical systems. The method involves defining the polarization of an optical field of light and a corresponding coupling-structure geometry. It includes providing a coupling structure in a metallic material and directing light with the defined polarization to form a lattice of plasmonic merons, achieving finer contrast resolution than traditional methods.
Career Highlights
Throughout her career, Yanan Dai has worked at prestigious institutions such as the University of Pittsburgh and Columbia University. Her research has focused on advancing the understanding and application of plasmonic materials in various technological fields.
Collaborations
Yanan has collaborated with notable researchers, including Hrvoje Petek and Zhikang Zhou. These collaborations have contributed to her innovative research and the development of her patented technologies.
Conclusion
Yanan Dai is a trailblazer in the field of plasmonics, with her groundbreaking patent and contributions to topological plasmonic technologies. Her work continues to inspire advancements in lithography and materials science.