New Taipei, Taiwan

Yan-Sian Jheng

This inventor holds 4 USPTO granted patents. Top assignee: Cooler Master Co., Ltd.. Active years: 2020-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yan-Sian Jheng. Retrieved from https://idiyas.com/inventor/yan-sian-jheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 75.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • New Taipei, JP (2021)
  • New Taipei, TW (2020 - 2024)

Company Filing History:


Years Active: 2020-2025

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4 patents (USPTO):Explore Patents

Title: Yan-Sian Jheng: Innovator in Heat Dissipation Technology

Introduction

Yan-Sian Jheng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of heat dissipation technology, particularly through his innovative designs that enhance the efficiency of heat sinks.

Latest Patents

Yan-Sian Jheng holds a patent for a heat sink and heat dissipation device. This invention features a cylindrical body with a plurality of fins that are connected to and protruding from the body. Each fin includes a first protrusion portion and a second protrusion portion, with the distal edge of the first protrusion positioned farther from the central axis than that of the second protrusion. This design aims to improve the effectiveness of heat dissipation in various applications.

Career Highlights

Yan-Sian Jheng is currently associated with Cooler Master Co., Ltd., a company renowned for its innovative cooling solutions. His work at Cooler Master has allowed him to apply his expertise in thermal management and contribute to the development of advanced cooling products.

Conclusion

Yan-Sian Jheng's contributions to heat dissipation technology exemplify the importance of innovation in enhancing product performance. His patent reflects a commitment to improving thermal management solutions in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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