Nes-Tziona, Israel

Yan Ivanchenko


Average Co-Inventor Count = 3.7

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Nes-Tziona, IL (2013 - 2017)
  • Nes-Ziona, IL (2017)

Company Filing History:


Years Active: 2013-2017

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3 patents (USPTO):Explore Patents

Title: Innovations by Yan Ivanchenko

Introduction

Yan Ivanchenko is a notable inventor based in Nes-Tziona, Israel. He has made significant contributions to the field of semiconductor technology, holding three patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is the CD-SEM technique for wafers fabrication control. This invention describes a Critical Dimensions Scanning Electron Microscope (CD-SEM) that includes a unit for performing CD-SEM measurements of a semiconductor wafer, a Backscattered Electron (BSE) imaging unit for obtaining a Grey Level image of the wafer, and a unit for Grey Level analysis and processing the results in relation to the CD-measurements. Another significant patent is the registration of CAD data with SEM images. This method involves providing a microscopic image of a structure fabricated on a substrate along with computer-aided design (CAD) data. The microscopic image is processed to generate a directionality map, which is then compared with a simulated image based on the CAD data to register the microscopic image accurately.

Career Highlights

Yan Ivanchenko works at Applied Materials Israel Limited, a company known for its advanced technology in the semiconductor industry. His work has contributed to the development of innovative solutions that enhance wafer fabrication processes.

Collaborations

He collaborates with talented coworkers, including Ishai Schwarzband and Adi Costa, who contribute to the innovative environment at Applied Materials Israel Limited.

Conclusion

Yan Ivanchenko's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in wafer fabrication and image processing techniques.

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