Ya Ping Hung

Title: Innovations of Ya Ping Hung in Semiconductor Technology

Introduction

Ya Ping Hung is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs in packaging.

Latest Patents

Ya Ping Hung holds a patent for a Ball Grid Array (BGA) package. This BGA package features a chip with an array pad design located on the upper surface of a substrate. The chip is equipped with multiple bonding pads positioned around its periphery, organized into three distinct rows: an inner row, a middle row, and an outer row. Notably, only power supply pads and ground pads are situated in the outer row, while all input/output pads are allocated to the middle and inner rows. The bonding pads are electrically connected to the substrate through three tiers of bonding wires, each with varying loop heights.

Career Highlights

Ya Ping Hung is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to advance semiconductor packaging technologies. His work has been instrumental in enhancing the efficiency and reliability of semiconductor devices.

Collaborations

Ya Ping Hung collaborates with talented colleagues, including Yung I Yeh and Te Tsung Chao, who contribute to the innovative environment at Advanced Semiconductor Engineering, Inc.

Conclusion

Ya Ping Hung's contributions to semiconductor technology, particularly through his patented BGA package design, highlight his role as a key innovator in the industry. His work continues to influence advancements in semiconductor packaging.