Hsinchu, Taiwan

Xusheng Wu

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xusheng Wu. Retrieved from https://idiyas.com/inventor/xusheng-wu-tiyzhkoq

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Xusheng Wu - Innovator in Semiconductor Technology

Introduction

Xusheng Wu is an inventor based in Hsinchu City, Taiwan. He is known for his contributions to semiconductor technology, focusing on innovative device structures and manufacturing methods. Although he currently holds no granted patents, his work in the field is noteworthy.

Latest Patent Applications

Xusheng Wu has submitted several patent applications that showcase his expertise in semiconductor devices. One of his latest applications is titled "SEMICONDUCTOR DEVICE WITH CORNER ISOLATION PROTECTION AND METHODS OF FORMING THE SAME." This application describes a semiconductor device that includes a semiconductor stack with layers separated by an isolation structure, along with a metal gate structure and various spacers. Another significant application is "SEMICONDUCTOR DEVICE WITH AIR GAPS BETWEEN METAL GATES AND METHOD OF FORMING THE SAME." This application details a semiconductor device featuring semiconductor fins and gate stacks separated by a dielectric layer with an air gap.

Conclusion

Xusheng Wu's innovative approaches to semiconductor devices highlight his potential impact on the industry. His latest patent applications reflect a commitment to advancing technology in this critical field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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