Shenzhen, China

Xue-Wen Peng

This inventor holds 27 USPTO granted patents and 4 published patent applications, primarily in Heat Dissipation Technology. Top assignees: Foxconn Technology Co., Ltd., Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.. Active years: 2005-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xue-Wen Peng. Retrieved from https://idiyas.com/inventor/xue-wen-peng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 11.1

Average Co-Inventor Count = 2.1

ph-index = 12

Forward Citations = 376(Granted Patents)


Location History:

  • Guangdong, CN (2008 - 2010)
  • Shenzhen, CN (2005 - 2011)

Company Filing History:


Years Active: 2005-2011

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Areas of Expertise:
Heat Dissipation Device
Vapor Chamber
Heat Sink
Computer Add-On Cards
Thermal Management
Heat Pipe
Dual-Fan Arrangement
VGA Card Assembly
Heat-Radiator
Fastener
Heat Dissipating Apparatus
Heat Dissipating Device
27 patents (USPTO):Explore Patents

Title: Xue-Wen Peng: Innovating Heat Dissipation Solutions

Introduction

Xue-Wen Peng is a prominent inventor based in Shenzhen, China, known for his contributions to advancements in heat dissipation technologies. With an impressive portfolio of 27 patents, he has made significant strides in improving the efficiency and performance of electronic components.

Latest Patents

Xue-Wen's latest patents include innovative heat dissipation devices designed specifically for add-on cards equipped with multiple processors. The first patent features a heat dissipation device that includes a vapor chamber, which thermally contacts the processors, and a mounting member secured to the bottom of the vapor chamber. This design efficiently handles heat generated during operation.

Another notable patent describes a heat dissipation device that incorporates two heat sinks and two heat pipes that connect with these heat sinks. Each heat sink is equipped with a base and a fin group, while the heat pipes consist of a connecting section and two heat-conductive sections. This dual-heat-pipe setup is designed to maximize thermal management for add-on cards.

Career Highlights

Throughout his career, Xue-Wen has been associated with major companies such as Foxconn Technology Co., Ltd. and Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. His work at these organizations has allowed him to focus on high-performance thermal solutions, making meaningful contributions to the electronics manufacturing sector.

Collaborations

During his professional journey, Xue-Wen has collaborated with notable colleagues, including Rui-Hua Chen and Bing Chen. These collaborations have likely been instrumental in enhancing his innovative concepts and bringing them to fruition in the competitive tech landscape.

Conclusion

Xue-Wen Peng continues to be a driving force in the realm of thermal management technology. His inventive spirit and dedication to solving complex engineering challenges underscore his importance as an inventor in today's rapidly evolving industry. His latest patents illustrate not only his technical expertise but also his commitment to improving the efficiency and reliability of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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