Xue Chun Dai

Title: Xue Chun Dai: Innovator in Plasma Etch Technology

Introduction

Xue Chun Dai is a notable inventor based in Singapore, recognized for his contributions to the field of microelectronics. He holds a total of 2 patents that focus on advanced plasma etch methods, which are crucial for the fabrication of microelectronic devices. His innovative approaches have significantly impacted the efficiency and effectiveness of silicon layer etching processes.

Latest Patents

Dai's latest patents include a "Plasma etch method for forming plasma etched silicon layer" and a "Selective etch method for selectively etching a multi-layer stack layer." The first patent describes a method for etching a silicon layer using a plasma reactor chamber and a specific gas composition that generates active bromine and chlorine etchant species. This method involves a series of steps to ensure a clean and seasoned plasma reactor chamber, enhancing the etching process. The second patent outlines a technique for creating a patterned microelectronic layer by selectively etching a multi-layer stack while protecting certain layers with an encapsulating layer. This method is particularly useful in the fabrication of field effect transistors (FETs).

Career Highlights

Xue Chun Dai is currently employed at Chartered Semiconductor Manufacturing Ltd, a prominent corporation in the semiconductor industry. His work at this company has allowed him to develop and refine his innovative etching methods, contributing to advancements in microelectronic manufacturing.

Collaborations

Throughout his career, Dai has collaborated with several talented individuals, including Mei Sheng Zhou and Chiew Wah Yap. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Xue Chun Dai's contributions to plasma etch technology exemplify the importance of innovation in the semiconductor industry. His patents not only enhance the efficiency of microelectronic device fabrication but also pave the way for future advancements in the field.