Company Filing History:
Years Active: 2022
Title: Innovations of Xixue Liu in Low-Temperature Lead-Free Soldering
Introduction
Xixue Liu is a prominent inventor based in Beijing, China. He has made significant contributions to the field of low-temperature soldering, particularly with his innovative patent for a SnBiSb series low-temperature lead-free solder. His work is crucial in advancing soldering technology, which is essential for various electronic applications.
Latest Patents
Xixue Liu holds a patent for a SnBiSb series low-temperature lead-free solder and its preparation method. This solder comprises a unique composition of 32.8-56.5% of Bi, 0.7-2.2% of Sb, with the remainder being Sn. The relationship between the weight percentages of Bi and Sb is defined by the equation b=0.006a²−0.672a+19.61+c, where 'a' represents the weight percentage of Bi, and 'b' represents the weight percentage of Sb. The solder alloy features a peritectic or near peritectic structure, which results in a low melting point and excellent mechanical performance and reliability. This innovation is particularly applicable in the field of low-temperature soldering.
Career Highlights
Xixue Liu is associated with Beijing Compo Advanced Technology Co., Ltd., where he continues to develop and refine his soldering technologies. His expertise in this area has positioned him as a key figure in the advancement of lead-free soldering solutions.
Collaborations
Xixue Liu has collaborated with notable colleagues, including Shaoming Zhang and Huijun He. Their combined efforts contribute to the innovative environment at their workplace, fostering advancements in solder technology.
Conclusion
Xixue Liu's contributions to low-temperature lead-free soldering represent a significant advancement in the field. His innovative patent and ongoing work at Beijing Compo Advanced Technology Co., Ltd. highlight his role as a leading inventor in this critical area of technology.