The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2022
Filed:
Nov. 17, 2016
Beijing Compo Advanced Technology Co., Ltd., Beijing, CN;
Shaoming Zhang, Beijing, CN;
Huijun He, Beijing, CN;
Xixue Liu, Beijing, CN;
Yanbin Sun, Beijing, CN;
Zhigang Wang, Beijing, CN;
Qiang Hu, Beijing, CN;
Ning An, Beijing, CN;
Fuwen Zhang, Beijing, CN;
Jie Zhu, Beijing, CN;
Jiangsong Zhang, Beijing, CN;
Lirong Wang, Beijing, CN;
Huankun Zhang, Beijing, CN;
Lei Xu, Beijing, CN;
Zhihua Zhu, Beijing, CN;
Pin Zhang, Beijing, CN;
BEIJING COMPO ADVANCED TECHNOLOGY CO., LTD., Beijing, CN;
Abstract
A SnBiSb series low-temperature lead-free solder and a preparation method thereof, which belongs to the technical field of low-temperature soldering. The lead-free solder includes by weight the following composition: 32.8-56.5% of Bi, 0.7-2.2% of Sb, with the remainder being Sn, wherein the weight percentages of Bi and Sb satisfy a relationship of b=0.006a2−0.672a+19.61+c, wherein the symbol a represents the weight percentage of Bi, the symbol b represents the weight percentage of Sb, and the range of c is −1.85≤c≤1.85. The solder alloy has a peritectic or near peritectic structure with a low melting point, and has an excellent mechanical performance and reliability, and applicable to the field of low-temperature soldering.