Fuwen Zhang

Title: Innovations of Fuwen Zhang: Pioneering Low-Temperature Lead-Free Solder

Introduction: Fuwen Zhang is a notable inventor based in Beijing, China, whose expertise lies in the field of low-temperature soldering. With a focus on sustainability and reliability, his innovative approaches have led to significant advancements in solder materials.

Latest Patents: Zhang holds a patent for a revolutionary SnBiSb series low-temperature lead-free solder. This patented solder comprises 32.8-56.5% of Bismuth (Bi) and 0.7-2.2% of Antimony (Sb), with the remainder comprising Tin (Sn). The unique composition ensures that the weight percentages of Bi and Sb conform to a sophisticated relationship defined by the formula: b=0.006a²−0.672a+19.61+c, where values for c range between -1.85 and 1.85. This lead-free solder showcases a peritectic or near-peritectic structure, characterized by a low melting point, outstanding mechanical performance, and supreme reliability, making it ideal for applications in low-temperature soldering.

Career Highlights: Fuwen Zhang is affiliated with Beijing Compo Advanced Technology Co., Ltd., where he leverages his knowledge in materials science to develop innovative solder technologies. His contributions have positioned the company as a leader in sustainable solder solutions.

Collaborations: Throughout his career, Zhang has worked closely with esteemed colleagues such as Shaoming Zhang and Huijun He. Their collaborative efforts have fostered a robust environment for research and development, enhancing the overall effectiveness of their work in solder technology.

Conclusion: Fuwen Zhang’s inventiveness in developing a low-temperature lead-free solder marks a significant stride towards more environmentally friendly manufacturing practices. His patent not only highlights his innovative spirit but also opens new avenues for future research and collaboration within the realm of solder applications.