Jiangsong Zhang

Title: Jiangsong Zhang: Innovator in Low-Temperature Lead-Free Solder Technology

Introduction

Jiangsong Zhang is a prominent inventor based in Beijing, China. He has made significant contributions to the field of low-temperature soldering, particularly with his innovative lead-free solder technology. His work is crucial in advancing environmentally friendly materials in electronics manufacturing.

Latest Patents

Jiangsong Zhang holds a patent for the SnBiSb series low-temperature lead-free solder and its preparation method. This invention pertains to the technical field of low-temperature soldering. The lead-free solder comprises a composition of 32.8-56.5% of Bi, 0.7-2.2% of Sb, with the remainder being Sn. The relationship between the weight percentages of Bi and Sb is defined by the equation b=0.006a²−0.672a+19.61+c, where 'a' represents the weight percentage of Bi, 'b' represents the weight percentage of Sb, and 'c' ranges from -1.85 to 1.85. This solder alloy features a peritectic or near peritectic structure, characterized by a low melting point and excellent mechanical performance and reliability, making it suitable for low-temperature soldering applications.

Career Highlights

Jiangsong Zhang is associated with Beijing Compo Advanced Technology Co., Ltd., where he continues to develop innovative solutions in solder technology. His expertise and dedication to research have positioned him as a key figure in the industry.

Collaborations

Jiangsong Zhang collaborates with notable colleagues, including Shaoming Zhang and Huijun He. Their combined efforts contribute to advancements in solder technology and related fields.

Conclusion

Jiangsong Zhang's contributions to low-temperature lead-free solder technology exemplify his commitment to innovation and environmental sustainability. His work not only enhances the performance of electronic components but also aligns with global efforts to reduce the use of harmful materials.