Company Filing History:
Years Active: 2023-2024
Title: Innovations of Xinyuan Cai in Chemical Mechanical Polishing
Introduction
Xinyuan Cai is a notable inventor based in Shanghai, China. He has made significant contributions to the field of chemical mechanical polishing, holding 2 patents that showcase his innovative approaches to improving polishing slurries.
Latest Patents
Cai's latest patents include a chemical mechanical polishing slurry that consists of silicon dioxide particles, a nitrogen-containing heterocyclic compound with one or more carboxy groups, and an ethoxylated butoxylated alky alcohol. This slurry is designed for polishing silicon oxide, polysilicon, and silicon nitride. Notably, the polishing rate for silicon nitride using this slurry is much higher than that for silicon oxide and polysilicon. The slurry can be effectively applied in scenarios where silicon oxide or polysilicon serves as the stop layer, allowing for precise control over the amount of material removed from the substrate surface during polishing.
Another significant patent by Cai is a chemical mechanical polishing solution that includes silica abrasive particles, a corrosion inhibitor, a complexing agent, an oxidizer, and at least one type of polyacrylic acid anionic surfactant. This innovative slurry decreases the removal rate of tantalum while increasing the removal rate of copper, effectively reducing copper dishing and dielectric erosion after polishing.
Career Highlights
Xinyuan Cai is currently employed at Anji Microelectronics (Shanghai) Co., Ltd. His work focuses on developing advanced materials and processes that enhance the efficiency and effectiveness of chemical mechanical polishing.
Collaborations
Cai collaborates with talented individuals in his field, including Jianfen Jing and Ying Yao, who contribute to his innovative projects and research.
Conclusion
Xinyuan Cai's contributions to the field of chemical mechanical polishing demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials science and engineering, paving the way for advancements in semiconductor manufacturing.