The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Dec. 26, 2018
Applicant:

Anji Microelectronics (Shanghai) Co., Ltd., Shangai, CN;

Inventors:

Jian Ma, Shanghai, CN;

Jianfen Jing, Shanghai, CN;

Junya Yang, Shanghai, CN;

Kai Song, Shanghai, CN;

Xinyuan Cai, Shanghai, CN;

Guohao Wang, Shanghai, CN;

Ying Yao, Shanghai, CN;

Pengcheng Bian, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/306 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01);
Abstract

The present invention discloses a chemical mechanical polishing slurry, the chemical mechanical polishing slurry comprises silica abrasive particles, a corrosion inhibitor, a complexing agent, an oxidizer, and at least one kind of polyacrylic acid anionic surfactant. The polishing slurry of the present invention can decrease the removal rate of tantalum while increasing the removal rate of copper, and reduce copper dishing and dielectric erosion after polish.


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