Shanghai, China

Xinpeng Sun

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xinpeng Sun. Retrieved from https://idiyas.com/inventor/xinpeng-sun-ekhcsemx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Xinpeng Sun: Innovator in Multi-Panel Computing Devices

Introduction

Xinpeng Sun is a notable inventor based in Shanghai, China. He has made significant contributions to the field of computing technology, particularly in the area of message conversion and communication protocols.

Latest Patents

Xinpeng Sun holds a patent for a system that facilitates message conversion and passthrough between devices and a processor in a multi-panel computing device. This innovative system includes a processor located in the lid portion of a computing device, which is communicatively coupled to multiple input/output (I/O) devices through various I/O communication protocols. The patent outlines a method for receiving a message from an I/O device, converting it to a different communication protocol, and transmitting it over a bus with fewer wires than initially used.

Career Highlights

Xinpeng Sun is currently employed at Intel Corporation, where he continues to work on cutting-edge technologies that enhance computing devices. His expertise in communication protocols and device integration has positioned him as a valuable asset in the tech industry.

Collaborations

Xinpeng has collaborated with various professionals in his field, including his coworker Israel A Cepeda Lopez. Their joint efforts contribute to the advancement of innovative solutions in computing technology.

Conclusion

Xinpeng Sun's work exemplifies the spirit of innovation in the tech industry. His contributions to multi-panel computing devices and communication protocols are paving the way for future advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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