XingZhi Liang

Title: Innovations by XingZhi Liang in Semiconductor Technology

Introduction

XingZhi Liang is a notable inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique system that enhances the efficiency of the wafer dicing process.

Latest Patents

XingZhi Liang holds a patent for a "System for separating a diced semiconductor die from a die attach tape." This system is designed to eject a semiconductor die from the tape to which it is affixed during the wafer dicing process. The invention includes an ejector tool featuring a support table, ejector pins, and a pick-up arm. The support table is connected to a vacuum source that creates negative pressure at the interface between the tape and the support table. Additionally, the support table has an aperture with chamfered sidewalls, allowing for efficient separation of the die from the tape.

Career Highlights

XingZhi Liang is currently employed at Sandisk Technologies Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in improving the processes involved in semiconductor manufacturing.

Collaborations

Some of his notable coworkers include King Hoo Ong and Jack Chang Chien. Their collaborative efforts contribute to the advancement of technology within their field.

Conclusion

XingZhi Liang's contributions to semiconductor technology exemplify the spirit of innovation. His patented system for die separation showcases his commitment to enhancing manufacturing processes. His work continues to influence the industry positively.