The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Feb. 16, 2012
Jack Chang Chien, Shanghai, CN;
King Hoo Ong, Shanghai, CN;
Weili Wang, Shanghai, CN;
LI Wang, Shanghai, CN;
Xingzhi Liang, Shanghai, CN;
Shicai MA, Shanghai, CN;
Jack Chang Chien, Shanghai, CN;
King Hoo Ong, Shanghai, CN;
Weili Wang, Shanghai, CN;
Li Wang, Shanghai, CN;
XingZhi Liang, Shanghai, CN;
Shicai Ma, Shanghai, CN;
SanDisk Technologies Inc., Plano, TX (US);
Abstract
A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.