This inventor holds 1 USPTO granted patent. Top assignee: Chinese Academy of Sciences. Active years: 2020.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2020
Title: Innovations by Xingyin Xiong in 3D Printing Technology
Introduction
Xingyin Xiong is a notable inventor based in Beijing, China. He has made significant contributions to the field of packaging technology, particularly through the use of 3D printing. His innovative approach has led to the development of a unique system-level packaging method that enhances efficiency and reliability in electronic components.
Latest Patents
Xingyin Xiong holds a patent for a "System-level packaging method and packaging system based on 3D printing." This invention outlines a comprehensive process that includes several steps. The method begins with providing a carrier and printing a first packaging substrate on its surface using a 3D printing technique. Metal wires are integrated into the first substrate, which is then used to fix and electrically connect a first component. The process continues with the printing of a second packaging substrate, which also incorporates metal wires and connects to the first substrate. This iterative process allows for the creation of a multilayer system-level packaging structure where all components are embedded. The final step involves printing a packaging cover plate. This method is advantageous due to its simplicity, low cost, minimal pollution, high efficiency, and reliability, making it suitable for system-level packaging.
Career Highlights
Xingyin Xiong is affiliated with the Chinese Academy of Sciences, where he conducts research and development in advanced packaging technologies. His work has garnered attention for its innovative use of 3D printing in creating efficient packaging solutions.
Collaborations
Xingyin collaborates with esteemed colleagues such as Zongwei Li and Kedu Han, contributing to advancements in their respective fields.
Conclusion
Xingyin Xiong's contributions to 3D printing technology and system-level packaging represent a significant advancement in the field. His innovative methods not only improve efficiency but also set a new standard for reliability in electronic component packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile