The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 2020
Filed:
Apr. 25, 2018
Institute of Geology and Geophysics Chinese Academy of Sciences, Beijing, CN;
Zongwei Li, Beijing, CN;
Xingyin Xiong, Beijing, CN;
Kedu Han, Beijing, CN;
Changchun Yang, Beijing, CN;
Abstract
The present invention discloses a system-level packaging method and packaging system based on 3D printing. The packaging method includes the following steps: providing a carrier; printing a first packaging substrate on the surface of the carrier by using a 3D printing method, wherein metal wires are disposed on the first packaging substrate; fixing a first component to the first packaging substrate, and electrically connecting the first component to the first packaging substrate; continuing to print a second packaging substrate on the surface of the first packaging substrate by using the 3D printing method, wherein metal wires are disposed on the second packaging substrate, and the second packaging substrate has an electrical connection with the first packaging substrate; fixing a second component to the second packaging substrate, and electrically connecting the second component to the second packaging substrate; repeating the above steps to form a multilayer system-level packaging structure in which all components are embedded; and printing a packaging cover plate by using the 3D printing method. The packaging method has the advantages of simple process, low cost, less pollution, high efficiency and high reliability, and meets the requirements of system-level packaging.