Company Filing History:
Years Active: 2015
Title: Innovations of Xingping Wang in Electronics Manufacturing
Introduction
Xingping Wang is a notable inventor based in Frederick, MA (US). He has made significant contributions to the field of electronics manufacturing, particularly in the area of coating technologies. His innovative methods have the potential to enhance the durability and performance of electronic components.
Latest Patents
Wang holds a patent for "Immersion tin silver plating in electronics manufacture." This patent describes a method for depositing a whisker-resistant tin-based coating layer on a copper substrate. The coating layer, which has a thickness between 0.5 micrometers and 1.5 micrometers, is designed to resist the formation of copper-tin intermetallics. This resistance is crucial, as it ensures that, after undergoing at least seven heating and cooling cycles, a region of the tin coating layer remains free of copper and is at least 0.25 micrometers thick.
Career Highlights
Xingping Wang is currently employed at Enthone Incorporated, where he applies his expertise in coating technologies. His work focuses on developing innovative solutions that improve the reliability of electronic components. Wang's contributions have been instrumental in advancing the manufacturing processes within the electronics industry.
Collaborations
Wang has collaborated with several colleagues, including Yung-Herng Yau and Cai Wang. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Xingping Wang's innovative work in electronics manufacturing, particularly his patented methods for coating technologies, showcases his commitment to enhancing the performance and reliability of electronic components. His contributions are valuable to the industry and highlight the importance of continuous innovation in technology.