The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2015
Filed:
Oct. 28, 2009
Yung-herng Yau, Allentown, PA (US);
Xingping Wang, Frederick, MA (US);
Cai Wang, Milford, CT (US);
Robert Farrell, Lyme, CT (US);
Pingping YE, Bethany, CT (US);
Edward J. Kudrak, Jr., Morganville, NJ (US);
Karl F. Wengenroth, Stratford, CT (US);
Joseph A. Abys, Guilford, CT (US);
Yung-Herng Yau, Allentown, PA (US);
Xingping Wang, Frederick, MA (US);
Cai Wang, Milford, CT (US);
Robert Farrell, Lyme, CT (US);
Pingping Ye, Bethany, CT (US);
Edward J. Kudrak, Jr., Morganville, NJ (US);
Karl F. Wengenroth, Stratford, CT (US);
Joseph A. Abys, Guilford, CT (US);
Enthone Inc., West Haven, CT (US);
Abstract
A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217° C. followed by cooling to a temperature between about 20° C. and about 28° C., there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick.