This inventor holds 1 USPTO granted patent. Top assignee: Asia Vital Components Co., Ltd.. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Innovations of Xing-Hui Li in Thermal Module Technology
Introduction
Xing-Hui Li is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of thermal management through his innovative designs. His work primarily focuses on enhancing the efficiency of thermal modules, which are essential in various electronic applications.
Latest Patents
Xing-Hui Li holds a patent for a thermal module that includes a copper base seat, at least one U-shaped aluminum heat pipe, an aluminum radiating fin assembly, and a copper embedding layer. The design features a heat absorption side and a heat conduction side, with the ability to form at least one first heat pipe receiving channel. The U-shaped aluminum heat pipe is strategically positioned to optimize heat absorption and conduction. This innovative approach allows for the direct welding of two different materials, enhancing the overall performance of the thermal module. He has 1 patent to his name.
Career Highlights
Xing-Hui Li is currently employed at Asia Vital Components Co., Ltd., where he continues to develop cutting-edge thermal solutions. His expertise in thermal management has positioned him as a valuable asset to the company and the industry at large.
Collaborations
Throughout his career, Xing-Hui Li has collaborated with talented individuals such as Han-Min Liu and Chih-Peng Chen. These partnerships have fostered a creative environment that encourages innovation and the development of advanced technologies.
Conclusion
Xing-Hui Li's contributions to thermal module technology exemplify the importance of innovation in enhancing electronic performance. His patented designs reflect a commitment to improving efficiency and functionality in thermal management systems.