The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Dec. 12, 2022
Applicant:

Asia Vital Components Co., Ltd., New Taipei, TW;

Inventors:

Chih-Peng Chen, New Taipei, TW;

Han-Min Liu, New Taipei, TW;

Xing-Hui Li, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28D 15/02 (2006.01); F28F 1/32 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0275 (2013.01); F28F 1/325 (2013.01); F28F 2275/06 (2013.01);
Abstract

A thermal module includes a copper base seat, at least one U-shaped aluminum heat pipe, an aluminum radiating fin assembly and a copper embedding layer. The copper base seat has a heat absorption side and a heat conduction side. The heat absorption side or the heat conduction side is recessed to form at least one first heat pipe receiving channel. The U-shaped aluminum heat pipe has a horizontal section as a heat absorption section and two vertical sections as condensation sections. The heat absorption section is positioned in the first heat pipe receiving channel. The aluminum radiating fin assembly has multiple radiating fins. The copper embedding layer is disposed on a surface of the heat absorption section of the U-shaped aluminum heat pipe. By means of the copper embedding layer, two different materials can be directly welded.


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