Singapore, Singapore

Xiaosong Tang

This inventor holds 1 USPTO granted patent. Top assignee: Chartered Semiconductor Manufacturing Ltd (Corporation). Active years: 2001.


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Innovations of Xiaosong Tang in Wafer Processing Technology.

Introduction

Xiaosong Tang is a notable inventor based in Singapore, recognized for his contributions to wafer processing technology. He holds a patent that showcases his innovative approach to improving wafer chuck designs, which are essential in semiconductor manufacturing.

Latest Patents

Xiaosong Tang's most recent patent is titled "Self aligning wafer chuck design for wafer processing tools." This invention features a wafer chuck designed to position and releasably hold a wafer. The design includes a support platform with an upper surface for supporting the wafer, along with wafer banking pins for precise positioning. A lift device is integrated to move the wafer in a slanted direction, enhancing the efficiency of wafer handling. The lift device comprises multiple wafer lifting fingers that extend in a biased and vertical direction, ensuring optimal support for the wafer during processing.

Career Highlights

Xiaosong Tang is currently employed at Chartered Semiconductor Manufacturing Ltd, a prominent corporation in the semiconductor industry. His work focuses on advancing technologies that improve wafer processing, contributing to the overall efficiency and effectiveness of semiconductor manufacturing.

Collaborations

Xiaosong has collaborated with esteemed colleagues such as Erzhuang Lzu and Yih-Shung Lin, who share his commitment to innovation in the field of semiconductor technology.

Conclusion

Xiaosong Tang's innovative contributions to wafer processing technology exemplify the importance of advancements in the semiconductor industry. His patent reflects a significant step forward in improving wafer handling and processing efficiency.

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