Company Filing History:
Years Active: 2012
Title: Innovations by Xiaoping Hu in 3D Integrated Circuit Design
Introduction
Xiaoping Hu is an accomplished inventor based in Sunnyvale, CA, known for his contributions to the field of integrated circuit design. He has developed innovative methods that enhance the efficiency and effectiveness of three-dimensional integrated circuits (3D-IC).
Latest Patents
Xiaoping Hu holds a patent for a "Method and apparatus for performing RLC modeling and extraction for three-dimensional integrated circuit (3D-IC) designs." This invention provides a system that performs RLC extraction for a 3D-IC die. The system receives a 3D-IC die description and transforms it into a set of 2D-IC die descriptions while maintaining equivalency. It then performs electrical property extraction using a 2D-IC extraction tool to obtain a 2D-IC RLC netlist file. Finally, the system combines these netlist files to form an RLC netlist file for the 3D-IC die description.
Career Highlights
Xiaoping Hu is currently employed at Synopsys, Inc., where he continues to push the boundaries of technology in integrated circuit design. His work has significantly impacted the efficiency of 3D-IC designs, making them more viable for modern applications.
Collaborations
Xiaoping has collaborated with notable colleagues, including Qiushi Chen and Beifang Qiu, who contribute to the innovative environment at Synopsys, Inc.
Conclusion
Xiaoping Hu's innovative work in 3D integrated circuit design exemplifies the advancements being made in the field of electronics. His patent and contributions continue to influence the industry positively.