Chengdu, China

Xiaolin Kang

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Texas Instruments Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xiaolin Kang. Retrieved from https://idiyas.com/inventor/xiaolin-kang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations of Xiaolin Kang in Semiconductor Technology.

Introduction

Xiaolin Kang is a notable inventor based in Chengdu, China. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances the efficiency of semiconductor packages.

Latest Patents

Xiaolin Kang holds a patent for a technology titled "Double stitch wirebonds." This invention involves a semiconductor package that comprises an electrically conductive surface and a bond wire coupled to this surface. The bond wire features a first stitch bond and a second stitch bond that is contiguous with the first. Notably, the second stitch bond partially overlaps with the first stitch bond, which improves the overall performance of the semiconductor package.

Career Highlights

Xiaolin Kang is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His work at Texas Instruments has allowed him to focus on innovative solutions that address the challenges faced in semiconductor packaging.

Collaborations

Xiaolin has collaborated with talented coworkers, including Ziqi Wang and Peng Peng. Their combined expertise contributes to the advancement of technology within their field.

Conclusion

Xiaolin Kang's contributions to semiconductor technology, particularly through his patent on double stitch wirebonds, demonstrate his innovative spirit and commitment to enhancing electronic components. His work at Texas Instruments Corporation continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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