The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Sep. 29, 2022
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Xiaolin Kang, Chengdu, CN;

Ziqi Wang, Chengdu, CN;

Huoyun Duan, Chengdu, CN;

Peng Peng, Chengdu, CN;

Ye Zhuang, Chengdu, CN;

Xiaoling Kang, Chengdu, CN;

Hongxia Deng, Chengdu, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/48456 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/85201 (2013.01);
Abstract

In some examples, a semiconductor package comprises an electrically conductive surface and a bond wire coupled to the electrically conductive surface. The bond wire includes a first stitch bond coupled to the electrically conductive surface, and a second stitch bond contiguous with the first stitch bond and coupled to the electrically conductive surface. The second stitch bond is partially, but not completely, overlapping with the first stitch bond.


Find Patent Forward Citations

Kang, Xiaolin. (2026). Double stitch wirebonds (U.S. Patent No. 12550771). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12550771

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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