This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Texas Instruments Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations by Hongxia Deng in Semiconductor Technology
Introduction
Hongxia Deng is a notable inventor based in Chengdu, China. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances the efficiency of semiconductor packages.
Latest Patents
Hongxia Deng holds a patent for "Double stitch wirebonds." This invention involves a semiconductor package that comprises an electrically conductive surface and a bond wire coupled to this surface. The bond wire features a first stitch bond and a second stitch bond that is contiguous with the first. Notably, the second stitch bond partially overlaps with the first stitch bond, which improves the overall performance of the semiconductor package. He has 1 patent to his name.
Career Highlights
Hongxia Deng is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His role at Texas Instruments allows him to work on cutting-edge technologies that drive innovation in electronic devices.
Collaborations
Hongxia collaborates with talented coworkers, including Ziqi Wang and Xiaoling Kang. Their combined expertise contributes to the advancement of semiconductor technologies within their organization.
Conclusion
Hongxia Deng's contributions to semiconductor technology through his patent on double stitch wirebonds exemplify the innovative spirit of modern inventors. His work continues to influence the industry and pave the way for future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile